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Design, Innovate, and Transcend!

For the last 14 years, Terasic has held the Innovate Asia Contest and has inspired countless future engineers to design, invent, and innovate! In 2018, the contest became a global contest - Innovate FPGA Design Contest.

InnovateFPGA Contest is not only a stage for thousands of contestants to communicate and exchange ideas; it is a global arena joined by developers from all over the world to invent the future of AI and FPGA with Terasic and Intel and compete for the greatest glory.

This year, the contest is open to all participants. We welcome developers from academia, maker community, and industry to showcase your innovation with real-world designs using Intel FPGAs!

Join the Contest Now!

Select your region first and register as team in your region.

2019 InnovateFPGA Topic – Artificial Intelligence at the Edge!

In today’s connected world, more and more data is being generated and processed locally, and now AI is expanding into new arenas including smart cities, robotics, smart retail, autonomous drones, health and safety. 2019 Innovate FPGA Design contest invites you to demonstrate your visions of how FPGAs can be used to develop smart devices at the edge using one of the following platforms of your choice: Terasic OpenVINO Starter Kit or Terasic DE10-Nano Kit. You are welcome to use Intel's FPGA AI Engine (OpenVINO/DLA) which is customizable to many different networks, or you could build your own AI engine from the ground up!

Contest Platforms

 
DE10-Nano   OpenVINO Starter Kit

 

Sponsors and Partners

         

Instruction for Contestants

How to Register: Sign up as team. Each team can consist of 1 to 3 participants.

Time Frame: Mar. 20. ~ Jun. 30. 2019

Design Paper Submission: Once registered, choose your targeted development platform from the two contest plaforms (DE10-Nano Kit or OpenVINO Starter Kit) and submit your project proposal based on the kit you select to Innovate FPGA website before June 30, 2019.

Terasic E-Mail: innovatefpga@terasic.com
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