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See the Latest Agilex Series Accelerators and System-on-Modules from Terasic Inc.!

 

 

 

 

DE10-Agilex Accelerator – Optimized to Accelerate

DE10-Agilex is based on the powerful Intel® Agilex™ FPGA to obtain speed and power breakthrough, with 45% higher performance, 40% lower power for equivalent performance. The accelerator includes PCI Express Gen 4.0 x16, two 200G QSFP-DD connectors and offers 32GB of DDR4 up to 680Gbps/820Gbps bandwidth to provide adaptable acceleration, maximum throughput and highly customizable processing of data for compute intensive applications.

 

Key Benefits:

  • Intel® Agilex™ F-Series FPGA (1473K LEs)
    • AGFB014R24B1E1V: Core speed -1, Transceiver speed -1
    • AGFB014R24B2E2V: Core speed -2, Transceiver speed -2
  • Full-height, 3/4-length form-factor package

  • With 2x5 timing expansion header for 1pps or other high precision clock inputs
  • 4 independent banks of DDR4 SO-DIMM sockets with error correction code (ECC):
    • For core speed -1 device: Up to 8GB@3200MT/s or 16GB@2666MT/s for each socket.
    • For core speed -2 device: Up to 8GB@2666MT/s or 16GB@2400MT/s for each socket.
  • Simplified design, lower power, and faster time-to-market with two QSFP-DD connectors for 200/100/40/25/10 GbE network interface and PCIe® Gen4 x16
  • Support Intel® OpenCL™ BSP, and Intel® oneAPI Toolkits

 

 

 


 

 

The image is not the production proudct image. Please refer to the specfications on the website.

 

Apollo Agilex SOM – Real-Time Compute for Edge AI Applications!

Apollo Agilex SOM takes advantage of the latest Intel® Agilex™ SoC with 1400K logic elements to obtain performance and power breakthrough (with up to 40% lower power than Stratix 10 series). Combining high-end hardware interfaces such as two high-capacity and high-bandwidth DDR4 SO-DIMM Sockets (up to 32GB DDR4), one on-board QSFP-DD connector, PCIe Gen 4x16 up to 31.5 GB/s, on-board USB-Blaster II, and FMC/FMC+ connectors for I/O expansion, the board delivers more than 2X the performance of previous generation development kits.

 

Block Diagram

 

 

Key Benefits:

  • Intel® Agilex™ F-Series SoC FPGA (1400K LEs).
    • AGFB014R24B1E1V: Core speed -1, Transceiver speed -1
    • AGFB014R24B2E2V: Core speed -2, Transceiver speed -2
  • FMC+ (including one PCIe Gen 4 x16 interface), and FMC connectors (including two 100GbE interfaces) support 24 high speed transceivers and provide interface expansion for users to develop with various high speed FMC daughter cards.

  • 2 independent banks of DDR4 SO-DIMM sockets with error correction code (ECC), up to 16GB@2666MT/s for each socket

  • Simplified design, lower power, and faster time-to-market with a QSFP-DD connector for 200/100/40/25/10 GbE network interface

  • Support USB 2.0 OTG, USB to UART and Gigabit Ethernet interface for HPS communication

  • Support Linux BSP
 
 
 

 

 

For more details, visit Terasic New Products.

 

 

 

 


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